HighChem Co., Ltd. will be exhibiting at the "39th NEPCON Japan" to be held at Tokyo Big Sight from Wednesday, January 22 to Friday, January 24, 2025. At the NEPCON Japan HighChem booth, we will introduce our next-generation cutting-edge materials.

Next-Generation Electronic Components

• In-house developed products: New solder paste/high thermal conductivity sheet/thick copper substrate
• Adhesive series including UV adhesives and epoxy adhesives
• Ultra-fine nickel nano powder and binders for electronic ceramics
• Dispersants for ceramic powder materials and more

Next-Generation Solar Cell Materials

• In-house developed products: Perovskite solar cell materials (hole transport materials, perovskite layer materials)
• Organic thin-film solar cells (OPV) materials

Semiconductor Materials

• Nata products: Semiconductor gases/electronic materials for ALD & CVD semiconductor processes/high-purity MO organometallic compounds
• Fluorine-based liquid solvents and refrigerants/compound semiconductor substrates and more