HighChem Co., Ltd. (Headquarters: Minato-ku, Tokyo; President & CEO: Taka Ushio; hereinafter "HighChem"), a global chemical trading and manufacturing company, has jointly developed an advanced solder paste with a Japanese company specializing in chemical product research and development (hereinafter "partner company"). This innovative product is compatible with next-generation displays including Mini/Micro LEDs and wearable devices, and a mass production system has been established. The product will be introduced at NEPCON Japan, to be held at Tokyo Big Sight from January 22-25, 2025.
Solder, widely used as a metal bonding material, is essential in the manufacturing of electrical and electronic equipment. With the proliferation of IoT appliances and wearable devices, electrical and electronic equipment has become increasingly precise and miniaturized, resulting in more stringent requirements for reliability and safety performance of bonding materials. The development of specialized solder paste has become essential, addressing not only precision, adhesion strength, and yield rates but also flexibility, environmental compatibility, and application-specific requirements.
The advanced solder paste jointly developed by HighChem Co., Ltd. and the partner company is suitable for both Mini LED and Micro LED applications currently under development by various manufacturers. Additionally, it serves as a bonding material for high-speed communication devices utilizing 4G and 5G technologies, as well as wearable devices such as smartwatches and earphones, enhancing overall device stability.
Features of the Advanced Solder Paste
1. Special Resin Coating
The advanced solder paste incorporates metal particles supported by specially engineered polymer resin, delivering superior insulation, adhesion, and stability compared to conventional solder paste. During the soldering process, when applying the solder paste to circuit boards, the resin provides thermal protection to the solder, ensuring optimal electrical conductivity and superior yield rates.
2. Compatible with Micro LED and Fine Component Assembly
Micro LED displays consist of LED elements smaller than 100 μm arranged on a planar surface. With LED chip dimensions below 100 μm, conventional solder presents challenges such as short circuits. HighChem's advanced solder paste accommodates spacing requirements as precise as 30 μm, enabling optimal soldering for fine component assembly.
3. One-Step Bonding Process
The advanced solder paste's specialized resin composition eliminates the requirement for underfill and cleaning processes typically associated with conventional metal-only soldering, enabling a streamlined one-step bonding process. Furthermore, HighChem offers customized solutions and rapid response capabilities to meet specific customer requirements.
About HighChem
HighChem operates as a chemical trading company and manufacturer, handling a broad range of products and technologies—from life science fields such as pharmaceuticals, food, and agrochemicals to cutting-edge electronic materials—in its trading division. In its sustainability division, which focuses on manufacturing functions, HighChem owns four research centers and a catalyst mass production plant in Japan and China. Building on its C1-based SEG® technology with a licensed annual production capacity of 10 million tons, the company is advancing the development and commercialization of decarbonization technologies that use CO2 as a raw material, along with efforts in biochemical technologies and battery system development. HighChem will continue to expand its business globally with innovative products, technologies, and services at its core.
Company Name: HighChem Co., Ltd.
Location: 11th Floor, Tokyo Toranomon Global Square, 1-3-1 Toranomon, Minato-ku, Tokyo
President: Taka Ushio
Business Overview: Import/export and sales of chemicals, contract manufacturing, technology licensing-related operations, catalyst manufacturing and sales, biodegradable materials sales, etc.
For media inquiries regarding HighChem's presence at NEPCON Japan, please contact: koho@highchem.co.jp
PDF https://highchem.co.jp/wp-content/uploads/2025/01/202501_New solder paste.pdfFor more information, please contact:
＜HighChem Co., Ltd. Public Relations office＞
Ms. Kuroiwa (+81-90-6539-4213) TEL: +81-3-5251-8580 E-mail: koho@highchem.co.jp
[Related information] Announcement of NEPCON JAPAN HighChem exhibition https://highchem.co.jp/topics/241220/
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