HighChem Co., Ltd. (Headquarters: Minato-ku, Tokyo; President & CEO: Taka Ushio; hereinafter "HighChem"), a global chemical trading and manufacturing company, has jointly developed an advanced solder paste with a Japanese company specializing in chemical product research and development (hereinafter "partner company"). This innovative product is compatible with next-generation displays including Mini/Micro LEDs and wearable devices, and a mass production system has been established. The product will be introduced at NEPCON Japan, to be held at Tokyo Big Sight from January 22-25, 2025.
Solder, widely used as a metal bonding material, is essential in the manufacturing of electrical and electronic equipment. With the proliferation of IoT appliances and wearable devices, electrical and electronic equipment has become increasingly precise and miniaturized, resulting in more stringent requirements for reliability and safety performance of bonding materials. The development of specialized solder paste has become essential, addressing not only precision, adhesion strength, and yield rates but also flexibility, environmental compatibility, and application-specific requirements.
The advanced solder paste jointly developed by HighChem Co., Ltd. and the partner company is suitable for both Mini LED and Micro LED applications currently under development by various manufacturers. Additionally, it serves as a bonding material for high-speed communication devices utilizing 4G and 5G technologies, as well as wearable devices such as smartwatches and earphones, enhancing overall device stability.
Features of the Advanced Solder Paste
1. Special Resin Coating
The advanced solder paste incorporates metal particles supported by specially engineered polymer resin, delivering superior insulation, adhesion, and stability compared to conventional solder paste. During the soldering process, when applying the solder paste to circuit boards, the resin provides thermal protection to the solder, ensuring optimal electrical conductivity and superior yield rates.
2. Compatible with Micro LED and Fine Component Assembly
Micro LED displays consist of LED elements smaller than 100 μm arranged on a planar surface. With LED chip dimensions below 100 μm, conventional solder presents challenges such as short circuits. HighChem's advanced solder paste accommodates spacing requirements as precise as 30 μm, enabling optimal soldering for fine component assembly.
3. One-Step Bonding Process
The advanced solder paste's specialized resin composition eliminates the requirement for underfill and cleaning processes typically associated with conventional metal-only soldering, enabling a streamlined one-step bonding process. Furthermore, HighChem offers customized solutions and rapid response capabilities to meet specific customer requirements.
About HighChem (https://highchem.co.jp/)
HighChem, a company with both chemical trading and manufacturing capabilities, has various products and technologies ranging from life science fields such as pharmaceuticals, food, and agrochemicals, to cutting-edge electronic materials. The Sustainability & Innovation Division, which represents its manufacturing function, has four research centers and one catalyst factory in Japan and China, and developing and commercializing decarbonization technologies which use CO2 as feedstock to produce chemicals. Meanwhile, HighChem C1-based SEG®, has already achieved a big success with a total capacity of more than10 million tons per year. HighChem also committed to develop biochemical technologies and next-generation battery technologies and globalize its business, offering more innovative products, technologies, and services.4 The company has two research laboratories and a catalyst mass production factory, with an annual production capacity of 1,000 We boast a track record of licensing 10,000 tons C1 system SEG ® Based on technology, CO2 We are also focusing on the development of biochemical technologies and storage battery systems, as well as the development and commercialization of decarbonization technologies that utilize renewable energy to manufacture Chemicals. We will continue to expand our business globally, centering on more innovative products, technologies and services.
Company Name: HighChem Co., Ltd.
Location: 11th Floor, Tokyo Toranomon Global Square, 1-3-1 Toranomon, Minato-ku, Tokyo
President: Taka Ushio
Business Overview: Import/export and sales of chemicals, contract manufacturing, technology licensing-related operations, catalyst manufacturing and sales, biodegradable materials sales, etc.
For media inquiries regarding HighChem's presence at NEPCON Japan, please contact: koho@highchem.co.jp
PDF https://highchem.co.jp/wp-content/uploads/2025/01/202501_New solder paste.pdfFor more information, please contact:
＜HighChem Co., Ltd. Public Relations office＞
Ms. Kuroiwa (+81-90-6539-4213) TEL: +81-3-5251-8580 E-mail: koho@highchem.co.jp
[Related information] Announcement of NEPCON JAPAN HighChem exhibition https://highchem.co.jp/topics/241220/
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