News Release
HighChem Exhibits at NEPCON Japan, Asia's Largest Electronics Show, Showcasing Semiconductor Materials That Harness Japan-China Synergies
HighChem Co., Ltd. (Headquarters: Minato-ku, Tokyo; President and CEO: Ushio Taka, hereinafter referred to as HighChem) will participate at NEPCON Japan, the largest electronics development and assembly expo in Asia, held from January 25 to 27 at Tokyo Big Sight.
HighChem aims to further expand its trading business, focusing on the import and export, between Japan and China, of advanced semiconductor materials and electronic materials, based on the trade of chemicals. This effort includes hiring highly skilled personnel and developing new products to accelerate business development in the electronic materials sector through its participation at NEPCON Japan.
Venue: Tokyo Big Sight East Exhibition Building
Booth number: 19-2
Introduction of the main exhibit products
Next generation packaging material nano solder particles
At the exhibition, HighChem will showcase next-generation packaging materials, with a spotlight on the "nano solder particles". These particles are notable for their potential to overcome challenges associated with miniaturization in electronic components.
This product is a semiconductor micro-packaging material that can be applied in the fields of 5G communications, mini/micro LEDs, and areas using traditional SMT (Surface Mount Technology) manufacturing techniques.
As semiconductor components shrink, there's a move towards using nano-grade particles in solder paste and conductive particles in ACF (Anisotropic Conductive Films). HighChem's newly developed "nano solder particles" address this trend, offering solutions to issues like oxidation and agglomeration caused by particle size reduction. HighChem is currently providing samples upon request, aiming to boost demand through their exhibition presence.
We also plan to exhibit other next-generation packaging materials.
Compound semiconductor substrate (wafer)
GaN substrate, SiC substrate, GaAs substrate, diamond substrate, etc.
HighChem is recognized for its import and export activities between Japan and China, especially in the electronic materials sector, leveraging its strengths in quality and cost. It has earned trust through years of reliable service. At the exhibition, HighChem will highlight semiconductor substrates like GaN, SiC, GaAs, and diamond substrates, showcasing their extensive production experience in the Japanese market. Additionally, a variety of semiconductor and electronic materials will be on display.
Dear All Journalists
If you would like to have an interview, please contact us via e-mail regarding the following.
1. Company media name
2. Names and the number of people who will be attending
3. Contact information on the day:
4. Date of visit: 25th, 26th, 27th
5. Estimated time to visit. For example: 10:00-14:00:
Media inquiries regarding this release
HighChem Co., Ltd. PR Division – Eriko Kuroiwa
E-mail: kuroiwa@highchem.co.jp Phone: +81-3-5251-8580 / +81-90-6539-4213 (Kuroiwa)