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Fine Chemicals Dept., Electronic Materials Div.

Product Information

Joint development (HighChem and a chemical product R&D company)

English Name

Bonding Adhesive

Product Features

Features

1. Coated with special resin

2. Suitable for mounting fine components such as micro LEDs

Applications

Soldering Chemicals
Mini/Micro LED
Wearable devices
High-speed communication equipment, etc.

Specification

Particle size

1

T9 RCP

2

T7 RCP

3

T5 RCP

Product introduction video

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