NEPCON Japan 2025 Exhibition Report
HighChem exhibited at the NEPCON Japan - Electronics Development & Manufacturing Expo, held at Tokyo Big Sight from January 22 to 24. This international exhibition is one of the largest of its kind in Asia, specializing in electronic components and materials.
Under the theme “Supporting the Future of Devices — Advanced Next-Generation Materials by HighChem,” the company showcased cutting-edge materials across three key categories: next-generation electronic components, next-generation solar cell materials, and semiconductor materials.
In this report, we highlight the “next-generation electronic components” category, which drew particular attention during the event—presented by our exhibition representative, Ms. Yan.
Under the theme “Supporting the Future of Devices — Advanced Next-Generation Materials by HighChem,” the company showcased cutting-edge materials across three key categories: next-generation electronic components, next-generation solar cell materials, and semiconductor materials.
In this report, we highlight the “next-generation electronic components” category, which drew particular attention during the event—presented by our exhibition representative, Ms. Yan.
“New Solder Paste” Compatible with Mini/Micro LED Applications
A 108-inch Mini LED TV showcasing the new solder paste
One of the most eye-catching displays at the venue was a massive 108-inch Mini LED television, which features HighChem’s newly developed solder paste—created in collaboration with its R&D partner.
“Solder is an essential bonding material used in a wide range of electronic devices. However, with the rise of wearables and other compact technologies, the demand for higher precision in solder and bonding materials is rapidly increasing,” explained Ms. Yan.
We asked Ms. Yan to explain the key features of the new solder paste in detail.
◆ Feature 1: Special Resin Coating
The main feature is that the solder particles are coated with a specially formulated resin. This proprietary coating significantly improves insulation, adhesion, and stability compared to conventional flux-free products.
◆ Feature 2: Compatibility with Ultra-Fine Components
Micro LED displays require precise placement of LEDs smaller than 100μm. Traditional solder materials often cause shorts or fail in such tight spaces, but this new solder paste is engineered to work reliably in spaces as narrow as 30μm.
◆Feature 3: One-Stop, Environmentally Friendly Bondinge
Unlike conventional soldering processes that require underfill or cleaning steps, the special resin in this paste eliminates the need for those steps, enabling a streamlined, eco-friendly bonding process.
This new solder paste is suitable not only for Mini/Micro LED displays but also for high-speed communication devices such as 4G and 5G, as well as for wearable electronics.
Thermal Management Material for Power Devices: “High Thermal Conductivity Sheet”
“High Thermal Conductivity Sheet” Featuring Excellent Thermal Performance
Alongside the solder paste, another highlight was the advanced packaging material “high thermal conductivity sheet.” Made by blending ceramic powder into a resin sheet, the product offers thermal conductivity above 15 W/m·K, along with excellent adhesion and insulation properties.
“Conventional heat dissipation materials are mainly ceramic-based, but they come with issues such as mismatched thermal expansion with copper foil, reduced yield, design constraints due to sheet thickness, and higher costs.”
The high thermal conductivity sheet, jointly developed by HighChem and its R&D partner, utilizes a specialized resin that enables the sheet thickness to be reduced to approximately 0.05–0.1 mm. This breakthrough has resulted in a revolutionary product that offers both weight reduction and cost efficiency.
This heat-dissipating sheet is suitable not only for household appliances such as air conditioners but also for power devices in EVs, trains, and solar power systems. We also offer custom solutions combining this sheet with thick copper substrates for high-current applications such as IGBT modules, providing tailored heat management solutions for our customers.
At NEPCON Japan, we showcased not only the two featured products, but also a wide range of cutting-edge materials handled by HighChem. Looking ahead, we aim to further expand our business scope to include high-performance downstream products such as semiconductor and electronic materials. In addition to the advanced packaging materials introduced, we are also actively proposing a variety of next-generation materials—including perovskite solar cell components. We welcome your inquiries and look forward to future collaboration.
